PM Modi meets NXP CEO, discusses semi conductors and innovation
30 March, 2023 | Vaishali Sharma
On Wednesday, PM Modi met with NXP President and CEO Kurt Sievers. The two discussed the transformative landscape in the world of semiconductors and innovation.
On Wednesday, Prime Minister Narendra Modi met with NXP President and CEO Kurt Sievers. The two discussed the transformative landscape in the world of semiconductors and innovation.
“Happy to have met Mr Kurt Sievers, the CEO of @NXP and discuss the transformative landscape in the world of semiconductors and innovation. India is emerging as a key force in these sectors, powered by our talented youth,” Prime Minister Narendra Modi tweeted.
“NXP CEO Kurt Sievers met with India’s PM Narendra Modi to discuss strengthening the semiconductor ecosystem, developing STEM workforce and startup ecosystem in India. We’re committed to driving innovation and positive change through our tech solutions in India”, NXP said in a tweet.
NXP Semiconductors N.V. is a Dutch semiconductor designer and manufacturer headquartered in Eindhoven, Netherlands, with offices worldwide.
In order to boost semiconductor manufacturing in the country, Union Minister for Electronics and Information Technology Ashwini Vaishnaw announced in February this year that the government will soon launch a programme to set the country on a good semiconductor path for the next ten years.
In December 2021, the government announced the Semicon India Programme, which will cost Rs 76,000 crore.
The programme seeks to support the development of the semiconductors and the display manufacturing ecosystem in India.
The minister had apprised the parliamentary consultative committee in 2023 that several state governments like Gujarat, Madhya Pradesh, Karnataka, Odisha, Telangana, Andhra Pradesh and Tamil Nadu are in talks with the companies to set up semiconductor manufacturing plants/fab complexes.
The Semicon India Programme aims to provide attractive incentive support to companies/consortia that are engaged in Silicon Semiconductor Fabs, Display Fabs, Compound Semiconductors / Silicon Photonics / Sensors (including MEMS) Fabs, Semiconductor Packaging (ATMP / OSAT) and Semiconductor Design.